A new approach to designing electronic systems for operation in extreme environments: Part I - The SiGe Remote Sensor Interface

Author

Diestelhorst, Ryan M. ; England, Troy D. ; Berger, Richard ; Garbos, Ray ; Ulaganathan, Chandradevi ; Blalock, Ben ; Cornett, Kimberly ; Mantooth, Alan ; Geng, Xueyang ; Dai, Foster ; Johnson, Wayne ; Holmes, Jim ; Alles, Mike ; Reed, Robert ; McCluskey,

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

27

Issue

6

fYear

2012

fDate

6/1/2012 12:00:00 AM

Firstpage

25

Lastpage

34

Abstract

We have described the modeling, circuit design, system integration, and measurement of a Remote Sensor Interface (Figure 20) that took place over a span of 5 years and 8 fabrication cycles. It was conceived as part of the Multi-Chip Module (MCM) shown in Figure 21, which also includes a digital control chip for clocking, programming, and read-out. Further work beyond the scope of this was performed to validate the RSI for the extreme environmental conditions of a lunar mission, and individual blocks are presently.

Keywords

Ge-Si alloys; field programmable gate arrays; logic design; logic testing; microcontrollers; remote sensing; space vehicle electronics; FPGA-based digital control system; MCM; RSI; SiGe; circuit design; digital control chip; electronic systems; lunar mission; multichip module; remote sensor interface; time 5 year; CIrcuit layout; Computer architecture; Design methodology; Digital control; Environmental factors; Integrated circuits; Microprocessors; NASA; Radar remote sensing; Remote sensing; Space missions; Space vehicles;

fLanguage

English

Journal_Title

Aerospace and Electronic Systems Magazine, IEEE

Publisher

ieee

ISSN

0885-8985

Type

jour

DOI

10.1109/MAES.2012.6328550

Filename

6328550