Integrity of Micro-Hotplates During High-Temperature Operation Monitored by Digital Holographic Microscopy

Author

Lai, Y.W. ; Koukourakis, N. ; Gerhardt, N.C. ; Hofmann, M.R. ; Meyer, R. ; Hamann, S. ; Ehmann, M. ; Hackl, K. ; Darakis, E. ; Ludwig, A.

Author_Institution

Res. Dept. Integrity of Small-Scale Syst./High-Temp. Mater., Ruhr-Univ. Bochum, Bochum, Germany

Volume

19

Issue

5

fYear

2010

Firstpage

1175

Lastpage

1179

Abstract

An investigation on the integrity of micro-hotplates using in situ digital holographic microscopy is reported. The surface topography and surface evolution of the devices during high-temperature operation (heating/cooling cycles) is measured with nanometer-scale resolution. A localized permanent out-of-plane surface deformation of 40% of the membrane thickness caused by the top measurement electrodes occurring after the first cycle is observed. The integrity-related issues caused by such a permanent deformation are discussed.

Keywords

deformation; electrochemical electrodes; holography; micromechanical devices; surface topography; cooling cycle; digital holographic microscopy; heating cycle; high-temperature operation; measurement electrodes; microhotplates; nanometer scale resolution; permanent deformation; surface deformation; surface topography; Biomembranes; Cooling; Electrodes; Heating; Surface topography; Temperature measurement; Digital holography; micro-hotplates; microelectromechanical systems integrity; surface topography;

fLanguage

English

Journal_Title

Microelectromechanical Systems, Journal of

Publisher

ieee

ISSN

1057-7157

Type

jour

DOI

10.1109/JMEMS.2010.2067442

Filename

5565375