• DocumentCode
    1314598
  • Title

    Analysis of parameters affecting beam gauge performance

  • Author

    Yadav, S. ; Kerby, J. ; Ozelis, J.P.

  • Author_Institution
    Fermi Nat. Accel. Lab., Batavia, IL, USA
  • Volume
    10
  • Issue
    1
  • fYear
    2000
  • fDate
    3/1/2000 12:00:00 AM
  • Firstpage
    1399
  • Lastpage
    1402
  • Abstract
    Beam gauges have been used in the last decade or so for measuring the internal azimuthal compressive coil stresses in superconducting magnets. In early model Large Hadron Collider Interaction Region (LHC IR) quadrupoles tested at Fermilab, the beam gauges indicated excessively high amounts of inner and outer coil prestress during the collaring process, inconsistent with the coil size and modulus data. In response to these measurements, a simple mechanics based quantitative understanding of different factors affecting beam gauges has been developed. A finite element model with contact elements and non-linear material behavior, confirmed with experimental results, was developed. The results indicate that a small plastic deformation of either the beam or the backing plate can cause significant errors in the measured stress values. The effect of variations in coil modulus and support boundary conditions on beam gauge performance are also discussed.
  • Keywords
    finite element analysis; particle accelerator accessories; strain gauges; stress measurement; superconducting magnets; transducers; Fermilab; Large Hadron Collider Interaction Region; backing plate; beam gauge performance; beam gauges; coil modulus; finite element model; internal azimuthal compressive coil stresses; nonlinear material behavior; plastic deformation; quadrupoles; superconducting magnets; support boundary conditions; Colliding beam devices; Compressive stress; Internal stresses; Large Hadron Collider; Magnetic analysis; Performance analysis; Stress measurement; Superconducting coils; Superconducting magnets; Testing;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.828500
  • Filename
    828500