DocumentCode
1314634
Title
Micro- to Nanostructured Devices for the Characterization of Scaling Effects in Shape-Memory Thin Films
Author
König, Dennis ; Ehmann, Michael ; Thienhaus, Sigurd ; Ludwig, Alfred
Author_Institution
Inst. for Mater., Ruhr-Univ. Bochum, Bochum, Germany
Volume
19
Issue
5
fYear
2010
Firstpage
1264
Lastpage
1269
Abstract
Two microfabricated devices designed as test platforms for the investigation of scaling effects in micro- to nanosized substrate-attached shape-memory alloy (SMA) thin films as well as freestanding (suspended) thin-film microbridges are presented. These micromachined test platforms allow for simultaneous nanomechanical, electrical, and thermal tests on thin-film microbridges and can be seen as a basis for nanoscale SMA thin-film applications. The functionality of these devices is demonstrated for Ti52Ni32Cu16 thin films as active material. The martensitic phase-transition temperatures for the thin films as substrate-attached or suspended microstructures as well as the dependence on the lateral dimensions were examined. It was found that decreasing the bridge width from 4 to 1 μm leads to a substantial and asymmetrical decrease of the phase-transition temperatures: 20% [austenite finish temperature (Af) and martensite start temperature (Ms)] and 80% [austenite start temperature (As) and martensite finish temperature (Mf)]. Furthermore, it was found that detaching the thin film from its substrate also leads to a decrease of the transition temperatures. Finally, it is shown that shape-memory thin-film nanowires can be fabricated and characterized using the proposed devices.
Keywords
microfabrication; nanofabrication; nanowires; nickel compounds; shape memory effects; superconducting microbridges; thin film devices; titanium compounds; SMA thin films; Ti52Ni32Cu16; freestanding thin film microbridges; martensitic phase transition temperature; microfabricated device; micromachined test platforms; microstructured devices; scaling effects; shape memory thin film nanowires; size 1 mum to 4 mum; substrate attached shape memory alloy; test platforms; Bridges; Etching; Metals; Nanoscale devices; Substrates; Temperature measurement; Nanoscale testing; Ti–Ni–Cu; scaling effect; shape-memory alloy (SMA); thin film;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2010.2067441
Filename
5565392
Link To Document