DocumentCode
1314778
Title
2.1 dB noise figure 5.2 GHz CMOS low noise amplifier using wafer-level integrated passive device technology with a DC power consumption of 10 mW
Author
Lin, Kung-Chien ; Chiou, H.-K. ; Chang, Da-Chiang ; Juang, Ying-Zong
Author_Institution
Dept. of Electr. Eng., Nat. Central Univ., Jhongli, Taiwan
Volume
6
Issue
11
fYear
2012
Firstpage
1286
Lastpage
1290
Abstract
This work presents an inductor with a high quality factor (Q) that is fabricated using wafer-level integrated passive device (IPD) technology and a 5.2 GHz differential low noise amplifier (DLNA) in a Taiwan semiconductor manufacturing company (TSMC™) 0.18 μm complementary metal-oxide-semiconductor (CMOS) process. The IPD inductors were stacked on top of a CMOS DLNA. The use of IPD inductors in the input matching network (IMN) is an efficient alternative to on-chip inductors for mass production. The performance of the DLNA with and without an IPD inductor is studied. The IPD CMOS-DLNA achieves a noise figure (NF) of 2.1 dB with a power consumption of 10 mW. The measured NF of the CMOS-IPD DLNA is 0.6 dB better than that of the typical CMOS DLNA at the same power consumption. The CMOS-IPD DLNA achieves the best figure of merit of any of the recently described 5-6 GHz CMOS LNAs.
Keywords
CMOS analogue integrated circuits; MMIC amplifiers; differential amplifiers; field effect MMIC; inductors; low noise amplifiers; three-dimensional integrated circuits; CMOS low noise amplifier; IPD inductors; complementary metal oxide semiconductor process; differential low noise amplifier; frequency 5.2 GHz; high quality factor inductor; input matching network; noise figure 2.1 dB; on chip inductor; power 10 mW; size 0.18 mum; wafer level integrated passive device technology;
fLanguage
English
Journal_Title
Microwaves, Antennas & Propagation, IET
Publisher
iet
ISSN
1751-8725
Type
jour
DOI
10.1049/iet-map.2011.0274
Filename
6329104
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