• DocumentCode
    1314968
  • Title

    Arbitrary convex and concave rectilinear block packing using sequence-pair

  • Author

    Fujiyoshi, Kunihiro ; Murata, Hiroshi

  • Author_Institution
    Dept. of Electron. Eng., Tokyo Univ. of Agric. & Technol., Japan
  • Volume
    19
  • Issue
    2
  • fYear
    2000
  • fDate
    2/1/2000 12:00:00 AM
  • Firstpage
    224
  • Lastpage
    233
  • Abstract
    The sequence-pair was proposed in 1995 as a representation of the packing of rectangles of general structure. Since then, there have been efforts to expand its applicability over simple rectangles. This paper proposes a unified way to represent the packing of a set of rectilinear blocks, including arbitrary concave rectilinear blocks. Our idea is in the representation of a general block by a collection of rectangle blocks with additional constraints, Some sequence-pairs of rectangle blocks with such constraints may not be feasible, i.e., there is no corresponding parking. A necessary and sufficient condition of feasible sequence-pair is given by the properties of the horizontal and vertical constraint graphs. Furthermore, it is proved that any packing is represented by a feasible sequence-pair. The condition includes dimensions of blocks involved. If we limit the rectilinear blocks to L-shaped ones, a necessary and sufficient condition can be represented only in terms of the topology of the sequence-pair, without dimensions of blocks. A packing algorithm is designed as an SA search of the generated sequence-pairs. Experimental results show the effectiveness of the proposed method
  • Keywords
    VLSI; circuit layout CAD; graph theory; integrated circuit layout; VLSI layout; concave rectilinear block packing; convex rectilinear block packing; horizontal constraint graph; packing algorithm; rectangles; sequence-pair; vertical constraint graph; Agricultural engineering; Agriculture; Algorithm design and analysis; Associate members; Stochastic processes; Sufficient conditions; Topology; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/43.828551
  • Filename
    828551