Title :
Impact Testing of Plug-In Circuit Packages for High Reliability
Author :
Kohl, R.C. ; Wadsworth, D.J.
Author_Institution :
Bell Telephone Laboratories, Inc., Holmdel, N. J.
Abstract :
A mechanical impact test has been used to improve the production reliability of plugin circuit packages for a Bell System electronic switching system. Mechanically unstable components which could cause intermittent electrical failures in system operation are located by monitoring the electrical output of the package during the test.
Keywords :
Acoustic testing; Circuit testing; Electric shock; Electronic equipment testing; Electronics packaging; Logic circuits; Logic testing; Production systems; Switching systems; System testing;
Journal_Title :
Reliability, IEEE Transactions on
DOI :
10.1109/TR.1965.5214886
