• DocumentCode
    1315467
  • Title

    Signal Integrity Enhanced EBG Structure With a Ground Reinforced Trace

  • Author

    Kim, Sang-Gyu ; Kim, Hyun ; Kang, Hee-Do ; Yook, Jong-Gwan

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea
  • Volume
    33
  • Issue
    4
  • fYear
    2010
  • Firstpage
    284
  • Lastpage
    288
  • Abstract
    In general, a conventional electromagnetic bandgap (EBG) structure efficiently suppresses simultaneous switching noise (SSN) over a wide frequency range. However, it is difficult to apply the geometry to the design of a real printed circuit boards (PCBs) for high-speed digital circuits due to the degradation in the signal integrity performance. In this paper, a ground reinforced trace (GRT) is added to the EBG power plane to guarantee power integrity (PI) as well as signal integrity (SI) simultaneously. In addition, the definition of a noise suppression bandwidth in an EBG structure is derived for the purpose of analyzing the correlation between the GRT and the noise suppression bandwidth. This correlation is utilized to decide the location of the GRT to mitigate the degradation of the low-pass cutoff frequency. As a result, an excellent signal performance is achieved without any degradation of the noise suppression bandwidth in a conventional EBG structure.
  • Keywords
    electronics packaging; high-speed integrated circuits; integrated circuit noise; printed circuits; electronics packaging; ground reinforced trace; high-speed digital circuits; noise suppression bandwidth; power integrity; printed circuit boards; signal integrity enhanced EBG structure; Bandwidth; Digital circuits; Metamaterials; Noise; Periodic structures; Printed circuits; Transmission line matrix methods; Electromagnetic bandgap (EBG) structure; power distribution networks; power integrity; signal integrity (SI); simultaneous switching noise (SSN); transmission line method;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2010.2064778
  • Filename
    5565520