DocumentCode
1315549
Title
A Low-Cost Built-In Redundancy-Analysis Scheme for Word-Oriented RAMs With 2-D Redundancy
Author
Tseng, Tsu-Wei ; Li, Jin-Fu
Author_Institution
Dept. of Electr. Eng., Nat. Central Univ., Jhongli, Taiwan
Volume
19
Issue
11
fYear
2011
Firstpage
1983
Lastpage
1995
Abstract
Built-in self-repair (BISR) techniques are widely used for repairing embedded random access memories (RAMs). One key component of a BISR module is the built-in redundancy-analysis (BIRA) design. This paper presents an effective BIRA scheme which executes the 2-D redundancy allocation based on a 1-D local bitmap. Two BIRA algorithms for supporting two different redundancy organizations are also proposed. Simulation results show that the proposed BIRA scheme can provide high repair rate (i.e., the ratio of the number of repaired memories to the number of defective memories) for the RAMs with different fault distributions. Experimental results show that the hardware overhead of the BIRA design is only about 2.9% for an 8192 × 64-bit RAM with two spare rows and two spare columns. Also, the ratio of the BIRA analysis time to the test time is only about 0.02% if the March-CW test is performed. Furthermore, a simulation flow is proposed to determine the size of the 1-D local bitmap such that the BIRA algorithm can provide the best repair rate using the smallest-size 1-D local bitmap.
Keywords
maintenance engineering; random-access storage; redundancy; 1D local bitmap; 2D redundancy allocation; BISR technique; built-in self-repair technique; fault distribution; low-cost BIRA scheme; low-cost built-in redundancy-analysis scheme; march-CW test; random access memory; redundancy organization; word-oriented RAM; Algorithm design and analysis; Built-in self-test; Circuit faults; Maintenance engineering; Random access memory; Redundancy; Resource management; Built-in redundancy-analysis (BIRA); RAMs; built-in self-repair (BISR); local bitmap; redundancy;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2010.2066587
Filename
5565531
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