• DocumentCode
    1315907
  • Title

    Structures and microwave losses in Ni/Cu/Ni/Au coatings on alumina

  • Author

    Choudhury, Debaditya

  • Volume
    26
  • Issue
    15
  • fYear
    1990
  • fDate
    7/19/1990 12:00:00 AM
  • Firstpage
    1203
  • Lastpage
    1204
  • Abstract
    A low cost, multilayer Ni/Cu/Ni/Au metallisation system has been developed for MIC applications. Heat treatments after the Cu and Au deposition improves the crystallinity of the system by decreasing the internal stresses. The ring resonator measurements show that the attenuation characteristic of this system is comparable with that of the conventionally used Cr/Au system.
  • Keywords
    copper; gold; heat treatment; metallisation; microwave integrated circuits; nickel; thin film circuits; Al 2O 3; MIC applications; Ni-Cu-Ni-Au; attenuation characteristic; crystallinity; internal stresses; metallisation system; multilayer metallisation; ring resonator measurements;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19900778
  • Filename
    82948
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1315907