Title :
Structures and microwave losses in Ni/Cu/Ni/Au coatings on alumina
Author :
Choudhury, Debaditya
fDate :
7/19/1990 12:00:00 AM
Abstract :
A low cost, multilayer Ni/Cu/Ni/Au metallisation system has been developed for MIC applications. Heat treatments after the Cu and Au deposition improves the crystallinity of the system by decreasing the internal stresses. The ring resonator measurements show that the attenuation characteristic of this system is comparable with that of the conventionally used Cr/Au system.
Keywords :
copper; gold; heat treatment; metallisation; microwave integrated circuits; nickel; thin film circuits; Al 2O 3; MIC applications; Ni-Cu-Ni-Au; attenuation characteristic; crystallinity; internal stresses; metallisation system; multilayer metallisation; ring resonator measurements;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19900778
