Title :
Speed limitations of multilayer digital packages
Author :
Conn, D.R. ; Xie, Shengli
Author_Institution :
Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
Abstract :
The limitations that are imposed on the performance of high-speed digital devices by multilayer ceramic packages are presented. It is demonstrated that the maximum speed of the system is limited by the package ground plane and that a maximum data rate of 11 Gbit/s can be achieved with multilayer packages using 0.75 mu m MESFET devices.
Keywords :
ceramics; field effect integrated circuits; integrated circuit technology; packaging; printed circuits; 0.75 micron; 11 Gbit/s; MESFET devices; PCB ground plane; high-speed digital devices; maximum data rate; maximum speed; multilayer ceramic packages; multilayer digital packages; package ground plane; speed limitations;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19901125
