DocumentCode :
1317448
Title :
Effect of polysilicon gate type on the flatband voltage shift for ultrathin oxide-nitride gate stacks
Author :
Wang, Zhigang ; Parker, Chris G. ; Hodge, Dexter W. ; Croswell, Robert T. ; Yang, Nian ; Misra, Veena ; Hauser, John R.
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Volume :
21
Issue :
4
fYear :
2000
fDate :
4/1/2000 12:00:00 AM
Firstpage :
170
Lastpage :
172
Abstract :
In this work, we demonstrate that the magnitude of flatband voltage (V/sub FB/) shift for ultrathin (<2 nm) silicon dioxide-silicon nitride (ON) gate stacks in MOSFET´s depends on the Fermi level position in the gate material. In addition, a fixed positive charge at the oxide-nitride interface was observed.
Keywords :
Fermi level; MOSFET; dielectric thin films; 2 nm; Fermi level position; SiO/sub 2/-Si/sub 3/N/sub 4/; fixed positive charge; flatband voltage shift; gate material; oxide-nitride interface; polysilicon gate type; ultrathin oxide-nitride gate stacks; Annealing; Boron; CMOS technology; Dielectric materials; Furnaces; MOSFET circuits; Permittivity; Plasma sources; Silicon; Voltage;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.830971
Filename :
830971
Link To Document :
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