DocumentCode :
1317481
Title :
Evaluation of Transient Behavior of Polysilicon-Bound Diode for Fast ESD Applications
Author :
Li, You ; Liou, Juin J.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of Central Florida, Orlando, FL, USA
Volume :
57
Issue :
10
fYear :
2010
Firstpage :
2736
Lastpage :
2743
Abstract :
Transient behaviors of poly-bound diodes subject to pulses generated by the very fast transmission line pulsing (VFTLP) tester are characterized for fast ESD events such as the charged device model. The effects of changing a diode´s dimension parameters on the transient behaviors and on the overshoot voltage and turn-on time are studied. The correlation between the diode failure and polygate configuration under the VFTLP stress is also investigated.
Keywords :
electrostatic discharge; elemental semiconductors; failure analysis; semiconductor device reliability; semiconductor diodes; silicon; transient analysis; Si; VFTLP stress; charged device model; diode failure; fast ESD events; overshoot voltage; polysilicon-bound diode; transient behavior evaluation; very fast transmission line pulsing tester; Anodes; Cathodes; Electrostatic discharge; Resistance; Stress; Testing; Transient analysis; Diodes; ESD; VFTLP; transient behavior;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2010.2063032
Filename :
5567140
Link To Document :
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