Title :
10 Gbit/s hybrid-integrated laser diode array module using a planar lightwave circuit (PLC)-platform
Author :
Mino, S. ; Ohyama, T. ; Akahori, Y. ; Yamada, Y. ; Yanagisawa, M. ; Hashimoto, T. ; Itaya, Y.
Author_Institution :
NTT Opto-Electron. Labs., Ibaraki, Japan
fDate :
11/21/1996 12:00:00 AM
Abstract :
A high-speed hybrid-integrated two-channel laser diode (LD) array module has been fabricated using a silica-based planar lightwave circuit (PLC) platform. A laser diode array was flip-chip bonded on a PLC platform using AuSn solder bumps. The module showed a wide 3 dB bandwidth of 10 GHz, which is wide enough for operation at 10 Gbit/s
Keywords :
flip-chip devices; high-speed optical techniques; integrated optoelectronics; optical fabrication; semiconductor laser arrays; 10 GHz; 10 Gbit/s; AuSn; AuSn solder bump; SiO2; fabrication; flip-chip bonding; high-speed hybrid-integrated two-channel laser diode array module; silica-based planar lightwave circuit platform;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19961464
