• DocumentCode
    1318579
  • Title

    Thermal stability of Pd-In ohmic contacts to n-GaAs formed by scanned electron beam and rapid thermal annealing

  • Author

    Prasad, K. ; Faraone, L. ; Nassibian, A.G.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Western Australia Univ., Nedlands, WA, Australia
  • Volume
    27
  • Issue
    2
  • fYear
    1991
  • Firstpage
    149
  • Lastpage
    151
  • Abstract
    Thermally stable and low resistance Pd-In ohmic contacts to n-GaAs were formed using scanned electron beam (SEB) and rapid thermal annealing (RTA). A specific contact resistance ( rho c) of the order of approximately 10-6 Omega cm2 was obtained using both SEB and RTA techniques with SEB annealed contacts exhibiting a superior surface morphology. High temperature aging (500 degrees C) of the contacts showed that SEB annealed contacts were more stable than RTA contacts as shown by the increase in their respective rho c values (an increase by a factor of approximately 5 for SEB annealed contacts against an increase by a factor of approximately 8 for RTA contacts after 25 hour s of aging).
  • Keywords
    III-V semiconductors; ageing; annealing; contact resistance; electron beam annealing; gallium arsenide; indium; metallisation; ohmic contacts; palladium; semiconductor-metal boundaries; 25 hrs; 500 degC; GaAs; Pd-In-GaAs; annealed contacts; high temperature ageing; low resistance Pd-In ohmic contacts; multilayer metallisation; n-GaAs; rapid thermal annealing; scanned electron beam annealing; specific contact resistance; surface morphology; thermal stability;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19910097
  • Filename
    83172