DocumentCode
1318579
Title
Thermal stability of Pd-In ohmic contacts to n-GaAs formed by scanned electron beam and rapid thermal annealing
Author
Prasad, K. ; Faraone, L. ; Nassibian, A.G.
Author_Institution
Dept. of Electr. & Electron. Eng., Western Australia Univ., Nedlands, WA, Australia
Volume
27
Issue
2
fYear
1991
Firstpage
149
Lastpage
151
Abstract
Thermally stable and low resistance Pd-In ohmic contacts to n-GaAs were formed using scanned electron beam (SEB) and rapid thermal annealing (RTA). A specific contact resistance ( rho c) of the order of approximately 10-6 Omega cm2 was obtained using both SEB and RTA techniques with SEB annealed contacts exhibiting a superior surface morphology. High temperature aging (500 degrees C) of the contacts showed that SEB annealed contacts were more stable than RTA contacts as shown by the increase in their respective rho c values (an increase by a factor of approximately 5 for SEB annealed contacts against an increase by a factor of approximately 8 for RTA contacts after 25 hour s of aging).
Keywords
III-V semiconductors; ageing; annealing; contact resistance; electron beam annealing; gallium arsenide; indium; metallisation; ohmic contacts; palladium; semiconductor-metal boundaries; 25 hrs; 500 degC; GaAs; Pd-In-GaAs; annealed contacts; high temperature ageing; low resistance Pd-In ohmic contacts; multilayer metallisation; n-GaAs; rapid thermal annealing; scanned electron beam annealing; specific contact resistance; surface morphology; thermal stability;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19910097
Filename
83172
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