DocumentCode :
1319118
Title :
On X-Variable Filling and Flipping for Capture-Power Reduction in Linear Decompressor-Based Test Compression Environment
Author :
Liu, Xiao ; Xu, Qiang
Author_Institution :
Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, Shatin, China
Volume :
31
Issue :
11
fYear :
2012
Firstpage :
1743
Lastpage :
1753
Abstract :
Excessive test power consumption and growing test data volume are both serious concerns for the semiconductor industry. Various low-power X-filling techniques and test data compression schemes were developed accordingly to address the above problems. These methods, however, often exploit the very same “don´t-care” bits in the test cubes to achieve different objectives and hence may contradict each other. In this paper, we propose novel techniques to reduce scan capture power in linear decompressor-based test compression environment, by employing algorithmic solutions to fill and flip X-variables supplied to the linear decompressor. Experimental results on benchmark circuits demonstrate that our proposed techniques significantly outperform existing solutions.
Keywords :
automatic test software; data compression; electronic engineering computing; integrated circuit testing; low-power electronics; power consumption; semiconductor device testing; X-variable filling; capture-power reduction; flipping; linear decompressor-based test compression environment; low-power X-filling technique; scan capture power; semiconductor industry; test data compression scheme; test power consumption; Equations; Filling; Input variables; Phase shifters; Power demand; Testing; Vectors; Capture-power reduction; X-filling; linear decompressor-based test compression;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2012.2201481
Filename :
6331656
Link To Document :
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