• DocumentCode
    1319118
  • Title

    On X-Variable Filling and Flipping for Capture-Power Reduction in Linear Decompressor-Based Test Compression Environment

  • Author

    Liu, Xiao ; Xu, Qiang

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, Shatin, China
  • Volume
    31
  • Issue
    11
  • fYear
    2012
  • Firstpage
    1743
  • Lastpage
    1753
  • Abstract
    Excessive test power consumption and growing test data volume are both serious concerns for the semiconductor industry. Various low-power X-filling techniques and test data compression schemes were developed accordingly to address the above problems. These methods, however, often exploit the very same “don´t-care” bits in the test cubes to achieve different objectives and hence may contradict each other. In this paper, we propose novel techniques to reduce scan capture power in linear decompressor-based test compression environment, by employing algorithmic solutions to fill and flip X-variables supplied to the linear decompressor. Experimental results on benchmark circuits demonstrate that our proposed techniques significantly outperform existing solutions.
  • Keywords
    automatic test software; data compression; electronic engineering computing; integrated circuit testing; low-power electronics; power consumption; semiconductor device testing; X-variable filling; capture-power reduction; flipping; linear decompressor-based test compression environment; low-power X-filling technique; scan capture power; semiconductor industry; test data compression scheme; test power consumption; Equations; Filling; Input variables; Phase shifters; Power demand; Testing; Vectors; Capture-power reduction; X-filling; linear decompressor-based test compression;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2012.2201481
  • Filename
    6331656