DocumentCode
1319118
Title
On X-Variable Filling and Flipping for Capture-Power Reduction in Linear Decompressor-Based Test Compression Environment
Author
Liu, Xiao ; Xu, Qiang
Author_Institution
Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, Shatin, China
Volume
31
Issue
11
fYear
2012
Firstpage
1743
Lastpage
1753
Abstract
Excessive test power consumption and growing test data volume are both serious concerns for the semiconductor industry. Various low-power X-filling techniques and test data compression schemes were developed accordingly to address the above problems. These methods, however, often exploit the very same “don´t-care” bits in the test cubes to achieve different objectives and hence may contradict each other. In this paper, we propose novel techniques to reduce scan capture power in linear decompressor-based test compression environment, by employing algorithmic solutions to fill and flip X-variables supplied to the linear decompressor. Experimental results on benchmark circuits demonstrate that our proposed techniques significantly outperform existing solutions.
Keywords
automatic test software; data compression; electronic engineering computing; integrated circuit testing; low-power electronics; power consumption; semiconductor device testing; X-variable filling; capture-power reduction; flipping; linear decompressor-based test compression environment; low-power X-filling technique; scan capture power; semiconductor industry; test data compression scheme; test power consumption; Equations; Filling; Input variables; Phase shifters; Power demand; Testing; Vectors; Capture-power reduction; X-filling; linear decompressor-based test compression;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/TCAD.2012.2201481
Filename
6331656
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