DocumentCode
1319907
Title
Carbon–Tungsten Thin-Film Deposition by a Dual Thermionic Vacuum Arc
Author
Lungu, C.P. ; Marcu, A. ; Porosnicu, C. ; Jepu, I. ; Kovac, J. ; Nemanic, V.
Author_Institution
Nat. Inst. for Lasers, Plasma & Radiat. Phys., Bucharest, Romania
Volume
40
Issue
12
fYear
2012
Firstpage
3546
Lastpage
3551
Abstract
Carbon and tungsten films were deposited simultaneously from two separate plasmas produced by the thermionic vacuum arc method. Total film thickness, surface roughness, atomic composition, and chemical bonds of atoms at the surface and inside the deposited films were analyzed for different substrate positions of the samples. X-ray photoelectron spectroscopy analyses suggest that tungsten carbide forms predominantly at preferential substrate positions. Variations in the carbon plasma deposition rate were also used to dynamically control the film composition. Larger target-substrate distances result in smoother films but slower composition variations.
Keywords
X-ray photoelectron spectra; bonds (chemical); carbon; plasma deposition; surface roughness; thin films; tungsten; vacuum arcs; Si; W-C; X-ray photoelectron spectroscopy; atomic composition; carbon-tungsten thin film deposition; chemical bonds; dual thermionic vacuum arc method; plasma deposition; preferential substrate; surface roughness; total film thickness; Carbon; Plasmas; Sputtering; Substrates; Tungsten; Vacuum arcs; Carbon; plasma; thermionic vacuum arc (TVA); thin-film deposition; tungsten;
fLanguage
English
Journal_Title
Plasma Science, IEEE Transactions on
Publisher
ieee
ISSN
0093-3813
Type
jour
DOI
10.1109/TPS.2012.2218621
Filename
6332530
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