DocumentCode
1320036
Title
Another dimension in device characterization
Author
Anand, Srinivasan
Author_Institution
Dept. of Electron., KTH, Kista, Sweden
Volume
16
Issue
2
fYear
2000
fDate
3/1/2000 12:00:00 AM
Firstpage
12
Lastpage
18
Abstract
Recent years have witnessed rapid progress in the area of high-resolution characterization of silicon devices by scanning capacitance microscopy (SCM). It is timely to discuss the applications of this technique in a broader context by addressing other types of devices and materials. This article represents a step towards this objective and will review our SCM work focusing on advanced InP-based laser structures. The basic principles involved in the SCM methodology are introduced, including resolution. The specific topics that will be covered include SCM analysis of regrowth on patterned substrates, different types of InP-based buried heterostructure (BH) lasers, and complex-coupled distributed feedback (CCCDFB) lasers. The behavior of the SCM signal in the different material and device-specific contexts is discussed, and device processing issues are highlighted. We also comment on the necessary factors for bringing the SCM technique to a level that can directly contribute to advanced III-V device technology
Keywords
III-V semiconductors; capacitive sensors; scanning probe microscopy; semiconductor device testing; semiconductor lasers; SCM analysis; buried heterostructure lasers; complex-coupled distributed feedback; device characterization; laser structures; patterned substrates; resolution; scanning capacitance microscopy; Capacitance; Distributed feedback devices; III-V semiconductor materials; Laser feedback; Microscopy; Optical materials; Pattern analysis; Signal processing; Signal resolution; Silicon devices;
fLanguage
English
Journal_Title
Circuits and Devices Magazine, IEEE
Publisher
ieee
ISSN
8755-3996
Type
jour
DOI
10.1109/101.833030
Filename
833030
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