DocumentCode :
1320188
Title :
Wave soldering bumping process incorporating electroless nickel UBM
Author :
Lin, Kwang-Lung ; Chen, Jun-Wen
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Volume :
23
Issue :
1
fYear :
2000
fDate :
3/1/2000 12:00:00 AM
Firstpage :
143
Lastpage :
150
Abstract :
The Si/Ti/Cu/electroless nickel/solder bump was produced incorporating wave soldering without flux. The most suitable wave soldering condition for depositing solder is presented. The material interactions occurring during wave soldering, afterwards reflow, and extended heat treatment were found to produce Ni3Sn2 , Ni3Sn4, and Ni4Sn compounds between solder and electroless nickel deposit. The thickness of electroless nickel deposit required for being the barrier layer of the solder bump was investigated by reflow process
Keywords :
electroless deposited coatings; flip-chip devices; nickel; wave soldering; Si-Ti-Cu-Ni; barrier layer; bumping process; compound formation; electroless nickel UBM; flip chip packaging; fluxless wave soldering; heat treatment; reflow process; under bump metallurgy; Chromium; Flip chip; Gold; Lead; Nickel; Packaging; Soldering; Sputtering; Surface tension; Tin;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/6144.833053
Filename :
833053
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1320188
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