• DocumentCode
    1320188
  • Title

    Wave soldering bumping process incorporating electroless nickel UBM

  • Author

    Lin, Kwang-Lung ; Chen, Jun-Wen

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • Volume
    23
  • Issue
    1
  • fYear
    2000
  • fDate
    3/1/2000 12:00:00 AM
  • Firstpage
    143
  • Lastpage
    150
  • Abstract
    The Si/Ti/Cu/electroless nickel/solder bump was produced incorporating wave soldering without flux. The most suitable wave soldering condition for depositing solder is presented. The material interactions occurring during wave soldering, afterwards reflow, and extended heat treatment were found to produce Ni3Sn2 , Ni3Sn4, and Ni4Sn compounds between solder and electroless nickel deposit. The thickness of electroless nickel deposit required for being the barrier layer of the solder bump was investigated by reflow process
  • Keywords
    electroless deposited coatings; flip-chip devices; nickel; wave soldering; Si-Ti-Cu-Ni; barrier layer; bumping process; compound formation; electroless nickel UBM; flip chip packaging; fluxless wave soldering; heat treatment; reflow process; under bump metallurgy; Chromium; Flip chip; Gold; Lead; Nickel; Packaging; Soldering; Sputtering; Surface tension; Tin;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/6144.833053
  • Filename
    833053
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1320188