DocumentCode
1320240
Title
Electronic part life cycle
Author
Pecht, Michael G. ; Das, Divya
Author_Institution
Maryland Univ., College Park, MD
Volume
23
Issue
1
fYear
2000
fDate
3/1/2000 12:00:00 AM
Firstpage
190
Lastpage
192
Abstract
The life cycle mismatch problem requires that engineers be cognizant of which parts will be available and obsolete when the product is to be manufactured. Next generation parts with improved performance characteristics must be anticipated in the design, to ensure that circuit timing, noise margins, and EMI nonconformances do not suddenly arise at the product level. An expensive part today may not be so at the time of manufacture, but assembly processes may have to be upgraded in order to use tomorrow´s parts. If the product requires a long application life, then an open architecture, or a parts obsolescence strategy, such as preventive redesign, lifetime buy, aftermarket purchases or part substitution may be required. So, what is the life cycle of a part? Most electronic parts pass through several life cycle stages corresponding to changes in part sales. A representative life cycle curve of units shipped per time is given, which depicts the six common life cycle part stages: introduction, growth, maturity, decline, phase-out and discontinuance. The article summarizes the characteristics over the stages of the part life cycle, An overview of each stage is presented
Keywords
electromagnetic interference; electronic equipment manufacture; electronics industry; life cycle costing; EMI nonconformances; aftermarket purchases; application life; circuit timing; decline; discontinuance; electronic part life cycle; growth; life cycle mismatch problem; lifetime buy; maturity; noise margins; open architecture; part substitution; parts obsolescence strategy; performance characteristics; phase-out; preventive redesign;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/6144.833060
Filename
833060
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