• DocumentCode
    1320240
  • Title

    Electronic part life cycle

  • Author

    Pecht, Michael G. ; Das, Divya

  • Author_Institution
    Maryland Univ., College Park, MD
  • Volume
    23
  • Issue
    1
  • fYear
    2000
  • fDate
    3/1/2000 12:00:00 AM
  • Firstpage
    190
  • Lastpage
    192
  • Abstract
    The life cycle mismatch problem requires that engineers be cognizant of which parts will be available and obsolete when the product is to be manufactured. Next generation parts with improved performance characteristics must be anticipated in the design, to ensure that circuit timing, noise margins, and EMI nonconformances do not suddenly arise at the product level. An expensive part today may not be so at the time of manufacture, but assembly processes may have to be upgraded in order to use tomorrow´s parts. If the product requires a long application life, then an open architecture, or a parts obsolescence strategy, such as preventive redesign, lifetime buy, aftermarket purchases or part substitution may be required. So, what is the life cycle of a part? Most electronic parts pass through several life cycle stages corresponding to changes in part sales. A representative life cycle curve of units shipped per time is given, which depicts the six common life cycle part stages: introduction, growth, maturity, decline, phase-out and discontinuance. The article summarizes the characteristics over the stages of the part life cycle, An overview of each stage is presented
  • Keywords
    electromagnetic interference; electronic equipment manufacture; electronics industry; life cycle costing; EMI nonconformances; aftermarket purchases; application life; circuit timing; decline; discontinuance; electronic part life cycle; growth; life cycle mismatch problem; lifetime buy; maturity; noise margins; open architecture; part substitution; parts obsolescence strategy; performance characteristics; phase-out; preventive redesign;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/6144.833060
  • Filename
    833060