• DocumentCode
    1320891
  • Title

    Antiferromagnetic Heusler Ru _{2} MnGe Epitaxial Thin Films Showing Néel Temperatures up to 353 K

  • Author

    Fukatani, N. ; Fujita, H. ; Miyawaki, T. ; Ueda, K. ; Asano, H.

  • Author_Institution
    Dept. of Crystalline Mater. Sci., Nagoya Univ., Nagoya, Japan
  • Volume
    48
  • Issue
    11
  • fYear
    2012
  • Firstpage
    3211
  • Lastpage
    3214
  • Abstract
    Structural and electrical transport properties were investigated for Heusler-type alloy Ru2 MnGe thin films. Ru2 MnGe films on MgO substrate were subjected to an in-plane compressive strain due to their small lattice mismatch (-0.7%), and exhibited enhanced antiferromagnetic transition temperature (TN) up to 353 K, which is much higher than that of the bulk material (TN = 316 K). In contrast, the films on MgAl 2O 4 were almost in a relaxed-strain state, and showed TN close to the bulk value (304 K). It was also found that the TN of Ru2MnGe thin films on MgO exhibited oscillating behavior depending on c/a ratio. We argued that the next-nearest neighbor magnetic interactions (J2) of Mn-Mn atoms has oscillated depending on the degree of strain in Ru2MnGe, which contribute to the oscillating behavior of TN against c/a.
  • Keywords
    Neel temperature; antiferromagnetic materials; electrical resistivity; magnetic epitaxial layers; magnetic transitions; metallic epitaxial layers; sputter deposition; Neel temperatures; Ru2MnGe; antiferromagnetic Heusler-type alloy epitaxial thin films; antiferromagnetic transition temperature; bulk material; direct-current magnetron sputtering; electrical resistivity; electrical transport properties; in-plane compressive strain; lattice mismatch; magnetic interactions; relaxed-strain state; structural properties; Compounds; Lattices; Magnetic properties; Metals; Strain; Substrates; Temperature measurement; Antiferromagnetic materials; Néel temperature; Ru $_{2}$MnGe; strain effect;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/TMAG.2012.2198874
  • Filename
    6332706