DocumentCode :
1322058
Title :
Decoupling Capacitor Placement in Power Delivery Networks Using MFEM
Author :
Choi, Jae Young ; Swaminathan, Madhavan
Author_Institution :
Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
1
Issue :
10
fYear :
2011
Firstpage :
1651
Lastpage :
1661
Abstract :
The impedance of the power distribution network (PDN) needs to be minimized in order to prevent unwanted voltage fluctuations at frequencies where current transients occur. To reduce PDN impedance, one can place decoupling capacitors that act as local current sources. However, selecting and placing the right capacitors at the right locations are problematic because of the complexity of modern package and board structures. In addition, decoupling capacitors are not effective at higher frequencies, requiring more complicated techniques such as embedded decoupling. This paper introduces a method of reducing the effort expended by the complex task of decoupling capacitor placement: a genetic algorithm that is customized for the selection and placement of decoupling capacitors. The core engine of this optimizing algorithm is a recently developed technique, the multilayer finite element method (MFEM), which solves for PDN impedances. This paper also highlights a method of incorporating vertical circuit elements into MFEM. Using several test cases, it proves the validity of the inclusion of vertical elements in MFEM and the effectiveness of the optimizer.
Keywords :
capacitors; distribution networks; finite element analysis; genetic algorithms; power electronics; PDN impedance; current transients; decoupling capacitor placement; embedded decoupling; genetic algorithm; multilayer finite element method; power delivery networks; power distribution network; unwanted voltage fluctuation; Admittance; Apertures; Capacitors; Equivalent circuits; Genetic algorithms; Impedance; Integrated circuit modeling; Decoupling capacitor; finite element method; genetic algorithm; power delivery network;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2011.2165954
Filename :
6020756
Link To Document :
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