DocumentCode
1322122
Title
Nano-Patterning of GMR Spin Valves by FIB Technique
Author
Riedmüller, Benjamin ; Herr, Ulrich
Author_Institution
Inst. of Micro & Nanomater., Ulm Univ., Ulm, Germany
Volume
48
Issue
11
fYear
2012
Firstpage
3662
Lastpage
3665
Abstract
In this work a process for nano-patterning of conventional giant magneto-resistive (GMR) spin valves by focused ion beam (FIB) technique is investigated. The sensors consisting of Si/SiO2[300]/Ta[5]/Ni79Fe21[6]/Co[1]/Cu[4]/Co[4]/ FeMn[20]/Ta[5] [thickness in nm] were produced by DC magnetron sputtering at a working pressure of 4 μbar. For microstructuring an image reversal based photolithographic process was developed, with which lateral dimensions of several micrometers can be reached. By modeling the sensor resistance as function of the lateral dimensions an effective width reduction of ~ 1.7 μm is found. A further reduction of the sensor dimensions was reached by using a 30 kV Ga+ ion beam from a commercial FIB microscope. After the FIB milling the sensor resistance shows a linear increase with the aspect ratio (length/width) down to ~ 500 nm sensor width. With further reduction of the sensor width, the GMR vanishes. This behavior can be explained by Ga implantation and sputtering effects in a region extending more than 100 nm away from the actual FIB cut edge, which is supported by high resolution EDX analysis.
Keywords
X-ray chemical analysis; cobalt; copper; focused ion beam technology; giant magnetoresistance; ion implantation; iron alloys; magnetic multilayers; magnetic sensors; manganese alloys; milling; nanofabrication; nanolithography; nanomagnetics; nanopatterning; nanosensors; nickel alloys; photolithography; silicon; silicon compounds; spin valves; sputter deposition; tantalum; DC magnetron sputtering; Ga implantation effect; Si-SiO2-Ta-Ni79Fe21-Cu-Co-FeMn; aspect ratio; effective width reduction; focused ion beam cut edge; focused ion beam microscope; focused ion beam milling; focused ion beam technique; gallium ion beam; giant magnetoresistive spin valve nanopatterning; high resolution EDX analysis; image reversal based photolithographic process; lateral dimensions; microstructuring; pressure 4 mubar; sensor dimension reduction; sensor resistance; sensor width reduction; size 1 nm; size 20 nm; size 300 nm; size 4 nm; size 5 nm; size 6 nm; sputtering effect; voltage 30 kV; working pressure; Ion beams; Milling; Radiation effects; Resistance; Spin valves; Cross-section; FIB cutting; edge rounding; ion induced damage; magnetic sensors; nano-patterning;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/TMAG.2012.2203296
Filename
6332909
Link To Document