DocumentCode :
1322686
Title :
Aging Effects in Gold Thermocompression Bonds to Complex Metallizations
Author :
Anderson, J.H., Jr. ; Maple, T.Grant ; Cox, William P.
Author_Institution :
Lockheed Palo Alto Research Laboratory, Palo Alto, Calif.; University of Rochester, Rochester, N.Y.
Issue :
1
fYear :
1970
Firstpage :
32
Lastpage :
34
Abstract :
The times to failure of Au thermocompression bonds to Au-Mo-Al and to Au-Ti-Al multilayer films were determined as a function of temperature over the range of 125-400°C and compared with the time to failure of gold bonds to aluminum films. A 500-Å Ti intermediate film was found to be ineffective as a barrier to reaction between gold and aluminum. On the other hand, a 500-Å Mo film was effective, providing increased time to failure over that observed for bonds to Au-Ti-Al and Al films. No failures were observed after 2000 hours at 400°C when gold wire bonds were made to an Au/Mo/Al metallization having 1000 Å of molybdenum as the intermediate layer.
Keywords :
Aging; Aluminum; Bonding; Gold; Integrated circuit interconnections; Integrated circuit metallization; Semiconductor films; Silicon; Titanium; Wire;
fLanguage :
English
Journal_Title :
Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9529
Type :
jour
DOI :
10.1109/TR.1970.5216376
Filename :
5216376
Link To Document :
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