Thick-film acoustic emission sensors for use in structurally integrated condition- monitoring applications

Author

Pickwell, A.J. ; Dorey, Robert A. ; Mba, D.

Author_Institution

Cranneld Univ., Cranfield, UK

Volume

58

Issue

9

fYear

2011

fDate

9/1/2011 12:00:00 AM

Firstpage

1994

Lastpage

2000

Abstract

Monitoring the condition of complex engineering structures is an important aspect of modern engineering, eliminating unnecessary work and enabling planned maintenance, preventing failure. Acoustic emissions (AE) testing is one method of implementing continuous nondestructive structural health monitoring. A novel thick-film (17.6 μm) AE sensor is presented. Lead zirconate titanate thick films were fabricated using a powder/sol composite ink deposition technique and mechanically patterned to form a discrete thick-film piezoelectric AE sensor. The thick-film sensor was benchmarked against a commercial AE device and was found to exhibit comparable responses to simulated acoustic emissions.

Keywords

acoustic devices; acoustic emission testing; condition monitoring; lead compounds; nondestructive testing; piezoelectric devices; sensors; acoustic emission testing; nondestructive structural health monitoring; powder-sol composite ink deposition technique; simulated acoustic emission; structurally-integrated condition; thick-film acoustic emission sensors; Acoustic emission; Monitoring; Sensors; Spectrogram; Time frequency analysis; Transforms;

fLanguage

English

Journal_Title

Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on

Publisher

ieee

ISSN

0885-3010

Type

jour

DOI

10.1109/TUFFC.2011.2043

Filename

6020874