• DocumentCode
    1323282
  • Title

    Low-Temperature Wiring with Ag Nanoinks [Nanopackaging]

  • Author

    Suganuma, Katsuaki ; Wakuda, Daisuke ; Hatamura, Mariko ; Nogi, Masaya

  • Author_Institution
    Tohoku Univ., Sendai, Japan
  • Volume
    4
  • Issue
    3
  • fYear
    2010
  • Firstpage
    20
  • Lastpage
    23
  • Abstract
    In this article, the mechanisms of these low-temperature curable inks are briefly reviewed. The dispersant removal by washing in alcohols for the nanoparticle ink and the decomposition behavior of the β-ketocarboxylate ink were clarified by thermal and microstructural analyses. The sintering and growth behaviors were also examined.
  • Keywords
    ink; nanoelectronics; nanofabrication; nanoparticles; silver; wiring; ß-ketocarboxylate ink; Ag; dispersant removal; low-temperature curable inks; low-temperature wiring; nanoinks; nanoparticle ink; Electronics packaging; Nanoelectronics; Printed circuits; Temperature measurement; Wiring;
  • fLanguage
    English
  • Journal_Title
    Nanotechnology Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    1932-4510
  • Type

    jour

  • DOI
    10.1109/MNANO.2010.938016
  • Filename
    5570799
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1323282