• DocumentCode
    132401
  • Title

    Normally-off GaN-on-Si multi-chip module boost converter with 96% efficiency and low gate and drain overshoot

  • Author

    Hughes, Brian ; Lazar, Josef ; Hulsey, Stephen ; Musni, Marcel ; Zehnder, Daniel ; Garrido, Austin ; Khanna, Rahul ; Chu, Raymond ; Khalil, Sahra ; Boutros, Karim

  • Author_Institution
    Energy Efficient Electron. Dept., HRL Labs. LLC, Malibu, CA, USA
  • fYear
    2014
  • fDate
    16-20 March 2014
  • Firstpage
    484
  • Lastpage
    487
  • Abstract
    A high efficiency synchronous GaN half-bridge boost converter with fast switching and low overshoot is achieved by minimizing parasitic inductance and critical damping the gate drive. A normally-off GaN-on-Si 2.4kW synchronous halfbridge Multi-Chip Module (MCM) is designed with a power-loop inductance of ~4nH using transmission-line techniques to minimize inductance. The gate circuit inductance is reduced to 1nH using bare MOSFET die for driving the GaN gates and a 0.5mil flexible substrate gate transmission-line. Configured as a boost converter with no added gate resistance, the synchronous half-bridge switches 400V in only 1.3ns. The high voltage slew rates of 325V/ns results in overshoot of 200V on the drain and 4V overshoot on the gate, both of which may damage the GaN switches. Critically damping the gate turn-on reduces overshoot to safe levels of 1V gate overshoot and ~20V drain overshoot. The gate damping increases drain fall time to 3ns, which only decreases efficiency by 0.2% at 1MHz. The resulting synchronous boost converter has an efficiency of 96%, switching 300V at 1MHz with 50% duty cycle and an output power of 2.4kW. The high efficiency of GaN switches and the 0.6C/W thermal resistance of the MCM enable a maximum junction temperature of 65°C.
  • Keywords
    III-V semiconductors; damping; elemental semiconductors; flexible electronics; gallium compounds; inductance; multichip modules; power MOSFET; power semiconductor switches; power transmission lines; silicon; switching convertors; thermal resistance; thyristors; wide band gap semiconductors; GaN switches; GaN-Si; MCM; bare MOSFET die; critical damping minimization; drain overshoot; flexible substrate gate transmission line; frequency 1 MHz; gate circuit inductance; gate damping; gate drive; gate overshoot; high voltage slew rates; normally-off GaN-on-Si multichip module boost converter; parasitic inductance minimization; power 2.4 kW; power loop inductance; synchronous GaN half bridge boost converter; synchronous half-bridge switches; thermal resistance; time 1.3 ns; voltage 1 V; voltage 200 V; voltage 300 V; voltage 4 V; voltage 400 V; Gallium nitride; Inductance; Logic gates; Resistance; Silicon; Substrates; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition (APEC), 2014 Twenty-Ninth Annual IEEE
  • Conference_Location
    Fort Worth, TX
  • Type

    conf

  • DOI
    10.1109/APEC.2014.6803352
  • Filename
    6803352