Title :
Ultrawideband Mitigation of Simultaneous Switching Noise and EMI Reduction in High-Speed PCBs Using Complementary Split-Ring Resonators
Author :
Bait-Suwailam, Mohammed M. ; Ramahi, Omar M.
Author_Institution :
Dept. of Electr. & Comput. Eng., Sultan Qaboos Univ., Muscat, Oman
fDate :
4/1/2012 12:00:00 AM
Abstract :
A novel technique for mitigating simultaneous switching noise propagation in high-speed printed circuit boards is presented. The proposed concept is based on etching complementary split-ring resonators (CSRRs) on only one metallic layer of the printed circuit board. By such topology, the electric field between the power planes can be suppressed. It is shown here that by concentrically cascading CSRRs, an ultrawideband suppression of switching noise from sub-GHz to 12 GHz is achieved. A prototype of the proposed concept was simulated, fabricated, and tested. Good agreement is observed between simulation and measurement. Moreover, electromagnetic interference radiation from such perforated boards is investigated. Finally, the performance of the proposed board with CSRRs is assessed through signal integrity analysis using eye diagrams and compared with a reference (solid) board.
Keywords :
electric fields; electromagnetic interference; etching; microwave resonators; printed circuits; EMI reduction; complementary split-ring resonator; concentrically cascading CSRR; electromagnetic interference radiation; etching; eye diagram; frequency 12 GHz; high-speed PCB; high-speed printed circuit board; metallic layer; perforated board; power plane electric field; signal integrity analysis; simultaneous switching noise propagation mitigation; ultrawideband mitigation; ultrawideband suppression; Dielectric losses; Electromagnetic interference; Noise; Photonic band gap; Solids; Switches; Complementary split-ring resonators (CSRRs); electromagnetic interference (EMI); electromagnetic radiation; power plane; simultaneous switching noise (SSN);
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2011.2163940