• DocumentCode
    1324792
  • Title

    Surface breakdown and stability of high-voltage planar junctions

  • Author

    Stengl, Reinhard ; Falck, Elmar

  • Author_Institution
    Siemens AG, Munich, Germany
  • Volume
    38
  • Issue
    9
  • fYear
    1991
  • fDate
    9/1/1991 12:00:00 AM
  • Firstpage
    2181
  • Lastpage
    2188
  • Abstract
    The authors introduce a one-dimensional model allowing evaluation of the surface electric field of planar resurf diodes or variation in lateral doping structures with an n+-channel stop ring. Based on this model the surface electric field of a resurf diode including a passivation layer with finite sheet resistance (e.g., thermal oxide) is calculated. In a series of self-consistent calculations, where the surface charge density depends on the surface electric field, it is shown that the gradient of the surface electric field causes charge buildup on top of the passivation layer due to its finite sheet resistance. It is shown that these induced surface charges can lead to surface breakdown of the underlying p-n junction. The calculations were confirmed by transient reverse current measurements, performed at a resurf diode with an n+-channel stop ring
  • Keywords
    electric breakdown of solids; electric fields; p-n junctions; semiconductor device models; semiconductor diodes; stability; finite sheet resistance; high-voltage planar junctions; lateral doping structures; n+-channel stop ring; one-dimensional model; p-n junction; passivation layer; planar resurf diodes; stability; surface charge density; surface electric field; thermal oxide; transient reverse current measurements; Diodes; Doping; Electric breakdown; Electric resistance; P-n junctions; Passivation; Semiconductor process modeling; Stability; Surface resistance; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.83746
  • Filename
    83746