• DocumentCode
    1325683
  • Title

    A general analysis of propagation along multiple-layer superconducting stripline and microstrip transmission lines

  • Author

    Nghiem, David ; Williams, Jeffery T. ; Jackson, David R.

  • Author_Institution
    Dept. of Electr. Eng., Houston Univ., TX, USA
  • Volume
    39
  • Issue
    9
  • fYear
    1991
  • fDate
    9/1/1991 12:00:00 AM
  • Firstpage
    1553
  • Lastpage
    1565
  • Abstract
    A rigorous spectral-domain formulation for a superconducting stripline or microstrip transmission line with a multiple-layer dielectric substrate is presented. The formulation models the strip conductor as a surface current with an equivalent surface impedance, where the surface impedance is approximated in closed form when the strip is either much thinner or much thicker than a penetration depth. In either case the surface impedance is related to the complex conductivity of the material, which is calculated from a two-fluid model. Results are presented to show the slow-wave propagation and attenuation along both microstrip and stripline packages in a realistic multiple-layer configuration, which accounts for the field penetration into the superconducting ground planes
  • Keywords
    strip lines; superconducting devices; transmission line theory; complex conductivity; equivalent surface impedance; field penetration; microstrip transmission lines; multi layer superconducting microstrip; multiple-layer configuration; multiple-layer dielectric substrate; multiple-layer superconducting stripline; penetration depth; rigorous spectral-domain formulation; slow-wave propagation; superconducting ground planes; two-fluid model; Attenuation; Conducting materials; Conductivity; Dielectric substrates; Microstrip; Stripline; Strips; Superconducting materials; Superconducting transmission lines; Surface impedance;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.83831
  • Filename
    83831