DocumentCode :
1325837
Title :
Some characteristics of the crystalline-amorphous threshold point of 31P+ ion-implanted silicon substrates
Author :
Aharoni, Herzl ; Swart, Pieter L. ; Lacquet, Bea M.
Author_Institution :
Dept. of ELectr. & Comput. Eng., Ben-Gurion Univ. of the Negev, Beer-Sheva, Israel
Volume :
38
Issue :
4
fYear :
1991
fDate :
8/1/1991 12:00:00 AM
Firstpage :
976
Lastpage :
978
Abstract :
During ion implantation a stage can be reached in which a continuous layer within the implanted crystal changes into amorphous material. The change begins when the implanted dose attains a certain threshold value (DT). In-situ reflectivity (R) versus dose (D) measurements, made during the implantation of 31P+ into Si single crystal substrates showing that both DT and the work (WoT) required to induce the threshold conditions within the implanted crystal increase with the implantation energy are reported. It is also shown that the change in reflectivity ΔRi, which occurs in the dose range that contains DT, is a function of E and peaks at 140 keV, the energy at which the damaged layer becomes buried. The ratio DA/DT is found to be a decreasing function of E
Keywords :
amorphisation; elemental semiconductors; ion beam effects; ion implantation; phosphorus; reflectivity; semiconductor doping; silicon; substrates; 31P+ ion-implanted; Si:P substrates; crystalline-amorphous threshold point; reflectivity; semiconductor; Africa; Amorphous materials; Crystallization; Ion implantation; Laboratories; Maintenance engineering; Reflectivity; Scattering; Silicon; Substrates;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/23.83861
Filename :
83861
Link To Document :
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