DocumentCode
1326028
Title
A no-trimming SLIC two-chip set with coin telephone signaling facilities
Author
Akata, Masao ; Nagataki, Yuichiro ; Koyabu, Kunihiro ; Mukai, Kanji ; Yoshida, Shiniji ; Morisaki, Shigeki ; Eda, Masahiro ; Ueki, Isamu ; Matsui, Toru
Author_Institution
NEC Corp., Kawasaki, Japan
Volume
25
Issue
2
fYear
1990
fDate
4/1/1990 12:00:00 AM
Firstpage
458
Lastpage
465
Abstract
A subscriber line interface circuit (SLIC) two-chip set that eliminates off-chip functional trimming and integrates coin telephone set facilities as well as BORSCHT functions is described. The LSI chip set consists of (a) a subscriber interface IC fabricated using a 320-V dielectrically isolated bipolar process with on-chip thin-film resistors and double-layer metal, and (b) a subscriber processor IC with oversampling A-D/D-A converters and a microprogrammable digital signal processor (DSP), using a 1.6-μm CMOS process. Chip sizes are 5.5 mm×6.06 mm and 6.0 mm×5.7 mm, respectively. Using the two-chip set, an SLIC for a coin telephone set can be designed without using high-precision filter components or hybrid ICs with functional trimming
Keywords
CMOS integrated circuits; analogue-digital conversion; bipolar integrated circuits; digital signal processing chips; digital-analogue conversion; large scale integration; subscriber loops; telephone sets; 1.6 micron; 320 V; 5.5 to 6.06 mm; ADC; BORSCHT functions; CMOS; DAC; DSP; LSI chip set; SLIC; bipolar IC; coin telephone signaling facilities; dielectrically isolated bipolar process; double-layer metal; functional trimming elimination; integrates coin telephone set facilities; microprogrammable digital signal processor; on-chip thin-film resistors; oversampling A-D/D-A converters; subscriber interface IC; subscriber line interface circuit; subscriber processor IC; two-chip set; Bipolar integrated circuits; CMOS digital integrated circuits; CMOS integrated circuits; Dielectric thin films; Digital signal processing chips; Digital signal processors; Large scale integration; Resistors; Telephony; Thin film circuits;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/4.52170
Filename
52170
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