Title :
Proximity Lithography in Sub-10 Micron Circuitry for Packaging Substrate
Author :
Wang, Fengtao ; Liu, Fuhan ; Kong, Linghua ; Sundaram, Venky ; Tummala, Rao R. ; Adibi, Ali
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Rapid changes in the semiconductor industry will continue toward higher functionality that leads to higher input/outputs (I/O) counts, pushing packaging towards higher density architectures. In the next two to three years, the I/O pitch will fall within 100 μm for area array die and 30 μm for periphery die. That raises an important question to the packaging industry: How will the rapid shrinkage of the I/O pitch affect the package substrate for chip attaching? The answer is sub-10 micron copper line technology. Theoretical and experimental studies on the limitations of using mercury i-line ultraviolet photolithography have been carried at the Packaging Research Center at Georgia Tech. Furthermore, ultra fine copper line routing substrates are demonstrated for flip chip attaching by using semi-additive metallization process.
Keywords :
electronics packaging; flip-chip devices; proximity effect (lithography); semiconductor industry; ultraviolet lithography; I/O pitch; copper line technology; flip chip attaching; i-line ultraviolet photolithography; micron circuitry; packaging industry; packaging substrate; proximity lithography; semiadditive metallization process; semiconductor industry; ultra fine copper line routing substrate; Lithography; Packaging; Resists; Routing; Substrates; Surface topography; Flip-chip devices; interconnections; lithography; packaging; printed circuit board (PCB) substrates; printed circuit fabrication;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2010.2072505