DocumentCode
1326346
Title
Single-Event Response of the SiGe HBT Operating in Inverse-Mode
Author
Phillips, Stanley D. ; Moen, Kurt A. ; Lourenco, Nelson E. ; Cressler, John D.
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
59
Issue
6
fYear
2012
Firstpage
2682
Lastpage
2690
Abstract
The single-event effect sensitivity of inverse-mode biased SiGe HBTs in both bulk and SOI technology platforms are investigated, for the first time, using digital circuits and stand-alone device test structures. Comparisons of heavy-ion broad beam data of shift register circuits constructed with forward-mode and inverse-mode biased SiGe HBTs from a first-generation, complementary SOI SiGe BiCMOS process, reveal an improvement in SEU mitigation for the inverse-mode shift register architecture. Full 3D TCAD simulations highlight the differences in transient current origination between forward and inverse-mode biased devices, illustrating the impact of doping profiles on ion-induced shunt duration. To extend the analysis to a bulk platform, new fourth-generation npn , SiGe HBTs were biased in both the forward and inverse-mode and irradiated at NRL using the two photon absorption measurement system. These measurements support the analysis of transient origination using 3D TCAD simulations. Furthermore, the isolation of the output terminal from the sensitive subcollector-substrate junction is experimentally demonstrated for the inverse-mode bias. Fully coupled mixed-mode simulations predict a significant reduction in sensitive area for inverse-mode shift registers built in a bulk SiGe platform.
Keywords
Ge-Si alloys; doping profiles; heterojunction bipolar transistors; ion beam effects; measurement systems; photoexcitation; semiconductor device measurement; shift registers; silicon compounds; silicon-on-insulator; technology CAD (electronics); 3D TCAD simulations; SEU mitigation; SOI technology platforms; SiGe; SiGe HBT operating; bulk SiGe platform; bulk platform; complementary SOI SiGe BiCMOS process; coupled mixed-mode simulations; digital circuits; forward-mode biased devices; fourth-generation npn; heavy-ion broad beam data; inverse-mode biased devices; inverse-mode shift register architecture; inverse-mode shift registers; ion-induced shunt duration; photon absorption measurement system; sensitive area reduction; sensitive subcollector-substrate junction; single-event response; stand-alone device test structures; transient current origination; transient origination; Heterojunction bipolar transistors; Radiation hardening; Shift registers; Silicon germanium; Single event upset; Transient analysis; Inverse-mode operation; radiation hardening; silicon germanium technology; single-event effect (SEE); single-event upset (SEU);
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/TNS.2012.2218129
Filename
6338319
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