Title :
Substrate bias effects on drain-induced barrier lowering in short-channel PMOS devices
Author :
Deen, Jamal M. ; Yan, Z.X.
Author_Institution :
Sch. of Eng. Sci., Simon Fraser Univ., Barnaby, BC, Canada
fDate :
7/1/1990 12:00:00 AM
Abstract :
It was found that, as the channel length decreased, the threshold voltage shift caused by drain-induced barrier lowering (DIBL) first increased with increasing substrate bias and then decreased as the channel length decreased further. The channel length (LINT ) corresponding to an almost zero change of the DIBL variation with substrate bias was found to be between 0.78 and 0.90 μm for the PMOS devices. This change in DIBL with substrate bias for devices with varying L can be explained as the transition of the surface DIBL effect to the subsurface DIBL effect and the onset of the punchthrough effect. Based on the experimental results, an empirical model for describing this substrate bias characteristic of the DIBL effect is developed
Keywords :
insulated gate field effect transistors; metal-insulator-semiconductor devices; semiconductor device models; 0.78 to 0.90 micron; DIBL; bias characteristic; channel length; drain-induced barrier lowering; empirical model; punchthrough effect; short-channel PMOS devices; substrate bias; threshold voltage shift; CMOS technology; Doping profiles; Helium; Implants; MOS devices; MOSFET circuits; Numerical simulation; Semiconductor process modeling; Threshold voltage; Very large scale integration;
Journal_Title :
Electron Devices, IEEE Transactions on