Title :
Observations of electrical contact surface in Cu-Ag/Ni couple with make/break
Author :
Honda, Fumihiro ; Imada, Y. ; Okumura, K. ; Nakajima, Koichi
Author_Institution :
Toyota Technol. Inst., Nagoya, Japan
fDate :
9/1/1991 12:00:00 AM
Abstract :
A mechanism of erosion (wear) and material transfer occurring on electrical contact surface during make/break was investigated with Cu-Ag/Ni couples. It was found that the state of contact surface depends largely on the duration of anodic arc discharge and that the formation of a thin film of Cu2O on the surface plays an important role in controlling the erosion and material transfer to be generated on the contact surface. On the basis of the experimental results, a model for explaining the configurational and compositional change in electrical contact surface has been proposed, which is composed of four kinds of stages per make/break cycle
Keywords :
copper alloys; electrical contacts; nickel; silver alloys; wear testing; Cu2O film formation; CuAg alloy; CuAg-Ni; compositional change; duration of anodic arc discharge; electrical contact surface; erosion mechanism; experimental results; four stage erosion; make/break cycle; material transfer; model; state of contact surface; wear mechanism; Adhesives; Arc discharges; Contact resistance; Delamination; Frequency; Oxidation; Surface cracks; Surface discharges; Surface resistance; Welding;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
