• DocumentCode
    1328319
  • Title

    Improvements to a Method for Estimating the Maximum Radiated Emissions From PCBs With Cables

  • Author

    Changyi Su ; Hubing, Todd H.

  • Author_Institution
    Clemson Univ., Clemson, SC, USA
  • Volume
    53
  • Issue
    4
  • fYear
    2011
  • Firstpage
    1087
  • Lastpage
    1091
  • Abstract
    It has been shown in previous studies that the coupling from ICs, traces, or heatsinks on a printed circuit board to an attached cable can be modeled by placing equivalent common-mode sources between the board and the cable. In a 2008 paper published in the IEEE Transactions on Electromagnetic Compatibility, a closed-form expression was developed to estimate the maximum radiated emissions from board-source-cable structures. While this expression is reasonably accurate for frequencies not exceeding 500 MHz, it may unnecessarily overestimate the emissions in some situations, especially when the maximum frequency of interest is extended beyond 500 MHz. This paper introduces two enhancements to the previously introduced closed-form expression based on improved methods for determining the maximum value of F(θ,k,l ) and the effective board size. The new closed-form expression is evaluated for various board geometries and frequency ranges by comparing the estimated maximum radiated emissions to full-wave simulation results.
  • Keywords
    cables (electric); electromagnetic compatibility; heat sinks; printed circuits; IEEE transactions; PCB; board geometries; board-source-cable structures; closed-form expression; electromagnetic compatibility; equivalent common-mode sources; heat sinks; maximum radiated emissions; printed circuit board; Accuracy; Closed-form solutions; Frequency estimation; Geometry; Integrated circuit modeling; Printed circuits; Resonant frequency; Common mode; electromagnetic modeling; electromagnetic radiation; imbalance difference model;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2011.2165217
  • Filename
    6026924