DocumentCode :
1329212
Title :
273-GHz 2X Subharmonic Up-Conversion Mixer for System-on-Package Applications
Author :
Li, Rui ; Lim, Teck Guan ; Ho, Soon Wee
Author_Institution :
Inst. of Microelectron., A*STAR, Singapore, Singapore
Volume :
2
Issue :
12
fYear :
2012
Firstpage :
1980
Lastpage :
1984
Abstract :
In this paper, a 273-GHz 2X subharmonic passive mixer is proposed for system-on-package applications. The mixer is designed and implemented using thin-film microstrip line on a three-layer package platform. The antiparallel-diode-pair-based mixer up-converts the 135-GHz IF input signal to 273 GHz with a 69-GHz local oscillator. The isolation between the IF and RF ports is achieved by a duplexer. The duplexer is composed of two dual-mode bandpass filters with uniform/nonuniform square ring resonators. The mixer is fabricated and measured, and the measured single-sideband conversion loss is 17.7 dB with an output RF of 270 GHz.
Keywords :
diodes; isolation technology; microstrip lines; millimetre wave mixers; millimetre wave oscillators; passive networks; system-on-package; thin film circuits; 2X subharmonic up-conversion passive mixer; IF input signal; IF port isolation; RF port isolation; antiparallel-diode-pair-based mixer up-conversion; dual-mode bandpass filter; duplexer; frequency 135 GHz; frequency 270 GHz; frequency 273 GHz; frequency 69 GHz; loss 17.7 dB; oscillator; single-sideband conversion loss; system-on-package application; thin-film microstrip line; three-layer package platform; uniform/nonuniform square ring resonator; Harmonic analysis; Loss measurement; Millimeter wave technology; Mixers; Radio frequency; Antiparallel diode pair (APDP); benzocyclobutene (BCB); millimeter-wave; subharmonic mixer; system-on-package (SOP);
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2012.2217341
Filename :
6341805
Link To Document :
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