DocumentCode
1329234
Title
Reactive ion etching of InAlAs and InAlGaAs with BCl3/Cl 2/CH4/H2 mixtures for long-wavelength VCSELs
Author
Shin, J.H. ; Yoo, B.S. ; Kwon, O.K.
Author_Institution
Telecommun. Basic Res. Lab., Electron. & Telecommun. Res. Inst., Taejeon, South Korea
Volume
36
Issue
6
fYear
2000
fDate
3/16/2000 12:00:00 AM
Firstpage
542
Lastpage
543
Abstract
A novel reactive ion etching process for the InAlGaAs material system lattice matched to InP using BCl3/Cl2/CH 4/H2 mixtures is presented. The etching speed is ~700 Å/min which remains approximately the same for all InAlGaAs compositions. The smoothness and the anisotropy of the etched wall appear to be very good. The etching characteristics of InP and mask materials are also reported
Keywords
III-V semiconductors; aluminium compounds; gallium arsenide; indium compounds; masks; semiconductor lasers; sputter etching; surface emitting lasers; InAlGaAs-InAlAs; anisotropy; etched wall; etching characteristics; etching speed; lattice matching; long-wavelength VCSELs; mask materials; reactive ion etching; smoothness;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20000400
Filename
840155
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