• DocumentCode
    13294
  • Title

    Popcorn Cavity Pressure

  • Author

    Shirley, C. Glenn

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Portland State Univ., Portland, OR, USA
  • Volume
    14
  • Issue
    1
  • fYear
    2014
  • fDate
    Mar-14
  • Firstpage
    426
  • Lastpage
    431
  • Abstract
    The evolution of the moisture concentration profile and cavity pressure in response to sudden exposure to a reflow ambient is shown for the simplest model of a plastic package with cavity. Careful definition of boundary conditions, particularly of the mass balance at the molding compound/cavity interface, shows that a superposition of two classical solutions to the diffusion equation for a specific class of boundary conditions is necessary. The boundary condition analysis also points the way to modeling cavity pressure correctly in more complicated and realistic cases. The zero cavity size limit of the analytical solution is interesting because it shows, contrary to common belief, that a cavity is not necessary for the existence of very high internal pressures to cause mechanical damage.
  • Keywords
    moulding; plastic packaging; reflow soldering; boundary conditions; cavity interface; diffusion equation; mass balance; mechanical damage; moisture concentration profile; molding compound; plastic package; popcorn cavity pressure; reflow ambient; zero cavity size limit; Boundary conditions; Cavity resonators; Compounds; Mathematical model; Moisture; Semiconductor device modeling; Slabs; Plastic integrated circuit packaging; reliability;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2013.2282301
  • Filename
    6601676