DocumentCode
13294
Title
Popcorn Cavity Pressure
Author
Shirley, C. Glenn
Author_Institution
Dept. of Electr. & Comput. Eng., Portland State Univ., Portland, OR, USA
Volume
14
Issue
1
fYear
2014
fDate
Mar-14
Firstpage
426
Lastpage
431
Abstract
The evolution of the moisture concentration profile and cavity pressure in response to sudden exposure to a reflow ambient is shown for the simplest model of a plastic package with cavity. Careful definition of boundary conditions, particularly of the mass balance at the molding compound/cavity interface, shows that a superposition of two classical solutions to the diffusion equation for a specific class of boundary conditions is necessary. The boundary condition analysis also points the way to modeling cavity pressure correctly in more complicated and realistic cases. The zero cavity size limit of the analytical solution is interesting because it shows, contrary to common belief, that a cavity is not necessary for the existence of very high internal pressures to cause mechanical damage.
Keywords
moulding; plastic packaging; reflow soldering; boundary conditions; cavity interface; diffusion equation; mass balance; mechanical damage; moisture concentration profile; molding compound; plastic package; popcorn cavity pressure; reflow ambient; zero cavity size limit; Boundary conditions; Cavity resonators; Compounds; Mathematical model; Moisture; Semiconductor device modeling; Slabs; Plastic integrated circuit packaging; reliability;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2013.2282301
Filename
6601676
Link To Document