DocumentCode :
133011
Title :
Data driven modeling and verification for silicon carbide JFET with thermal effects
Author :
Ruan Li-gang ; Zhu Ping ; Wang Li
Author_Institution :
Electr. Eng. Dept., Nanjing Univ. of Aeronaut. & Astronaut., Nanjing, China
fYear :
2014
fDate :
16-20 March 2014
Firstpage :
2649
Lastpage :
2653
Abstract :
A data driven model with thermal effects is proposed for normally-off SiC JFET in this paper. The novel feature of the model is that it saves the trouble of obtaining the physical parameters. Besides, the effect of temperature on SiC JFET performance is taken into account. It is important because the physical parameters on materials and dimensions of a particular SiC JFET device are difficult to be obtained for device users. The model is implemented based directly upon the characteristics of device datasheet and data from experimental tests. Simulation and experiments are carried out for the research of steady state characteristics, switching characteristics and short-circuit characteristics, which verify the accuracy of the model. Method of data driven modeling can be applied to the other power semiconductor switches.
Keywords :
junction gate field effect transistors; power field effect transistors; semiconductor device models; silicon compounds; wide band gap semiconductors; SiC; data driven modeling; data driven verification; physical parameters; power semiconductor switches; short-circuit characteristics; silicon carbide JFET; steady state characteristics; switching characteristics; thermal effects; Data models; Integrated circuit modeling; JFETs; Junctions; Silicon carbide; Switches; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Power Electronics Conference and Exposition (APEC), 2014 Twenty-Ninth Annual IEEE
Conference_Location :
Fort Worth, TX
Type :
conf
DOI :
10.1109/APEC.2014.6803678
Filename :
6803678
Link To Document :
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