Title :
Thermal analysis of a submodule for modular multilevel converters
Author :
Wu Cong, M. ; Avenas, Y. ; Miscevic, M. ; Wang, M.-X. ; Mitova, R. ; Lavieville, J.-P. ; Lasserre, P.
Author_Institution :
G2Elab, Univ. Grenoble Alpes, Grenoble, France
Abstract :
This paper presents a loss calculation method based on the selection of IGBTs and Diodes, and on an analysis of conduction and switching losses in multilevel pulse width modulation (PWM) systems. A comparison between the Modular Multilevel Converter (MMC) and other multilevel topologies, adapted to medium voltage applications, will thus be presented in order to highlight issues such as thermal disparity within the power modules. The proposed method is applied to the MMC topology to show the impact of the variation of different operation parameters on the thermal behaviors, especially with that of AC and DC currents.
Keywords :
PWM power convertors; thermal analysis; AC currents; DC currents; IGBTs; MMC topology; PWM systems; conduction losses; diodes; loss calculation method; modular multilevel converters; multilevel pulse width modulation system; multilevel topology; power modules; switching losses; thermal analysis; thermal behaviors; thermal disparity; Capacitors; Insulated gate bipolar transistors; Multichip modules; Pulse width modulation; Semiconductor diodes; Switches; Topology; Modular Multilevel Converter; Power module; circulation currents; losses calculation;
Conference_Titel :
Applied Power Electronics Conference and Exposition (APEC), 2014 Twenty-Ninth Annual IEEE
Conference_Location :
Fort Worth, TX
DOI :
10.1109/APEC.2014.6803682
