DocumentCode :
1330860
Title :
Increase of Q -Factor of RF Magnetic Thin Film Inductor by Introducing Slit-Patterned Magnetic Thin Film and Multiline-Conductor Spiral Coil
Author :
Maruyama, Tetsuhiro ; Obinata, Y. ; Sonehara, Makoto ; Ikeda, Ken-ichi ; Sato, Takao
Author_Institution :
Spin Device Technol. Center, Shinshu Univ., Nagano, Japan
Volume :
47
Issue :
10
fYear :
2011
Firstpage :
3196
Lastpage :
3199
Abstract :
In order to increase Q -factor of radio-frequency (RF) magnetic thin film inductor integrated in chip-size-package RF-ICs, two schemes have been investigated experimentally. For suppressing the in-plane eddy current of the magnetic thin film, a slit-patterned structure was introduced, and it was found that the slit-patterned magnetic thin film is very effective for increasing Q-factor. On the other hand, for suppressing alternating current (ac) copper loss, a multiline-conductor spiral coil was introduced, and it was found that the multiline coil is effective for improving decrease of inductance at high frequencies. By introducing the two schemes, a maximum Q-factor of 18 at 1.5 GHz was obtained in a spiral inductor with a bottom slit-patterned CoFeSiO/SiO2 granular multilayer film and triple-line-conductor spiral coil.
Keywords :
Q-factor; cobalt alloys; eddy current losses; iron alloys; magnetic thin film devices; silicon compounds; thin film inductors; CoFeSiO-SiO2; Q-factor; RF magnetic thin film inductor; alternating current copper loss; chip-size-package; frequency 1.5 GHz; granular multilayer film; high-frequency effect; in-plane eddy current; multiline-conductor spiral coil; slit-patterned magnetic thin film; spiral inductor; triple-line-conductor spiral coil; Coils; Inductors; Magnetic multilayers; Magnetic resonance; Perpendicular magnetic anisotropy; Spirals; $Q$ -factor; Alternating current (ac) copper loss; RF front/end; cell-phone; eddy current; inductor; on-chip radio-frequency (RF) magnetic thin film devices; wireless local area network (LAN);
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/TMAG.2011.2147287
Filename :
6027843
Link To Document :
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