• DocumentCode
    1330864
  • Title

    Fabrication of Planar Power Inductor for Embedded Passives in LSI Package for Hundreds Megahertz Switching DC–DC Buck Converter

  • Author

    Ito, H. ; Takeuchi, A. ; Okazaki, Shun ; Kobayashi, Hideo ; Sugawa, Y. ; Takeshima, A. ; Sonehara, Makoto ; Matsushita, Nobuhiro ; Sato, Takao

  • Author_Institution
    Spin Device Technol. Center, Shinshu Univ., Nagano, Japan
  • Volume
    47
  • Issue
    10
  • fYear
    2011
  • Firstpage
    3204
  • Lastpage
    3207
  • Abstract
    Recently, research and development of integrated low-voltage dc-dc converter to LSIs has been active. In order to realize such integrated dc power supply, power magnetic devices must be integrated in it. The authors have fabricated planar power inductor embedded in LSI package for hundreds megahertz switching dc-dc buck converter. In this study, two types of planar power inductors have been fabricated: one was spin-sprayed Zn-ferrite thick film magnetic core inductor, and the other was composite magnetic core (Fe-based amorphous/polyimide) inductor. Footprint of the fabricated inductors was 850×850 μm2, their inductance was about 10 nH, and the quality factor Q was about 20 at 100 MHz. The rating current which depends on the superimposed dc characteristic was at least up to 2 A.
  • Keywords
    DC-DC power convertors; Q-factor; integrated circuit packaging; iron; large scale integration; low-power electronics; magnetic cores; magnetic devices; power inductors; switching convertors; thick film inductors; zinc; LSI package; composite magnetic core inductor; embedded passives; frequency 100 MHz; hundred megahertz switching DC-DC buck converter; integrated DC power supply; integrated low-voltage DC-DC converter; iron-based amorphous-polyimide inductor; planar power inductor fabrication; power magnetic devices; quality factor; spin-sprayed zinc ferrite thick film magnetic core inductor; Amorphous magnetic materials; Inductance; Inductors; Large scale integration; Magnetic cores; Polyimides; Saturation magnetization; Fe-based amorphous/polyimide composite core; LSI package; Planar power inductor; Zn-ferrite thick film core; dc–dc converter; embedded passives;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/TMAG.2011.2147288
  • Filename
    6027844