• DocumentCode
    1331094
  • Title

    High-strength glass-ceramic ferrule for SC-type single-mode optical fiber connector

  • Author

    Takeuchi, Y. ; Mitachi, S. ; Nagase, R.

  • Author_Institution
    NTT Opto-Electron. Labs., Ibaraki, Japan
  • Volume
    9
  • Issue
    11
  • fYear
    1997
  • Firstpage
    1502
  • Lastpage
    1504
  • Abstract
    A high-strength Li/sub 2/O-Al/sub 2/O/sub 3/-SiO/sub 2/ glass-ceramic ferrule has been realized by using a precise glass-ceramic drawing technique which was developed to reduce production costs. With the ion-exchange process that applies the residual compressive stress to the surface layer, the bending strength of the ferrule reached about 500 MPa, which is similar to that of an alumina ferrule. It maintained a bending strength of 310 MPa after scratching. The Young´s modulus and micro Vickers hardness are similar to those of silica-glass optical fiber. The linear expansion coefficient is far smaller than that of zirconia. These characteristics suggest the stable physical contact and the easy endface polishing as the optical connector.
  • Keywords
    Young´s modulus; alumina; aluminosilicate glasses; bending strength; ceramics; drawing (mechanical); ion exchange; lithium compounds; microhardness; optical communication equipment; optical fabrication; optical fibre couplers; optical fibre subscriber loops; optical glass; polishing; Li/sub 2/O-Al/sub 2/O/sub 3/-SiO/sub 2/; SC-type single-mode optical fiber connector; Young´s modulus; bending-strength; easy endface polishing; high-strength glass-ceramic ferrule; ion-exchange process; linear expansion coefficient; micro Vickers hardness; optical connector; precise glass-ceramic drawing technique; production costs; residual compressive stress; stable physical contact; surface layer; Ceramics; Compressive stress; Connectors; Costs; Crystalline materials; Glass; Optical device fabrication; Optical fibers; Optical materials; Silicon compounds;
  • fLanguage
    English
  • Journal_Title
    Photonics Technology Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1041-1135
  • Type

    jour

  • DOI
    10.1109/68.634722
  • Filename
    634722