DocumentCode :
1331276
Title :
Development of a Reliable Micro-Hotplate With Low Power Consumption
Author :
Xu, Lei ; Li, Tie ; Gao, Xiuli ; Wang, Yuelin
Author_Institution :
Grad. Sch. of the Chinese Acad. of Sci., China
Volume :
11
Issue :
4
fYear :
2011
fDate :
4/1/2011 12:00:00 AM
Firstpage :
913
Lastpage :
919
Abstract :
In this paper, a reliable micro-hotplate with low power consumption is demonstrated by optimizing its structure and materials. Its power consumption is successfully decreased by adopting a structure with two high length-to-width slender beams. High reliability is achieved by improving its mechanical strength and long-term stability. A stacked membrane with residual stress controlled and corner compensations improve its mechanical strength. Pt heater element and Al2O3 adhesive layer deposited by atomic layer deposition (ALD) improve its long-term stability. Test results indicate that the micro-hotplate consumes only 18 mW when heated up to 400°C with a heating response time<;5 ms and cooling response time<;3 ms. It can sustain at least 842400 circles pulsed-mode operation with ultra-low resistance drift and can continuously work stably at around 450°C for at least 500 h.
Keywords :
adhesives; aluminium compounds; atomic layer deposition; domestic appliances; electric heating; heating elements; mechanical stability; mechanical strength; platinum; power consumption; reliability; ALD; adhesive layer; atomic layer deposition; corner compensation; heater element; long-term stability; low power consumption; mechanical strength; microhotplate reliability; residual stress; slender beams; stacked membrane; ${rm Al}_{2} {rm O} _{3}$; Pt; low power consumption; micro-hotplate; reliability;
fLanguage :
English
Journal_Title :
Sensors Journal, IEEE
Publisher :
ieee
ISSN :
1530-437X
Type :
jour
DOI :
10.1109/JSEN.2010.2064765
Filename :
5582154
Link To Document :
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