DocumentCode :
1331645
Title :
Reduced electron mobility due to nitrogen implant prior to the gate oxide growth
Author :
Kamgar, Avid ; Clemens, J.T. ; Ghetti, A. ; Liu, C.T. ; Lloyd, E.J.
Author_Institution :
Bell Labs., Lucent Technol., Murray Hill, NJ, USA
Volume :
21
Issue :
5
fYear :
2000
fDate :
5/1/2000 12:00:00 AM
Firstpage :
227
Lastpage :
229
Abstract :
We have found that nitrogen incorporation in the gate-oxide, by implantation into the Si, degrades the low field inversion mobility. Although submicron transistors fabricated using nitrogen implantation have been reported to show higher drive currents compared with "pure" oxides, we have measured about 20% degradation in large area transistors for a 2e14 cm/sup -2/ nitrogen implant. These measurements were done using nMOS transistors with thin gate-oxides (<4 nm). Thickness determination was done by simulation fit to capacitance-voltage (C-V) measurements by including quantization and tunneling effects. Furthermore, we observed that the decrease in the mobility has an increased sensitivity to the channel doping concentration.
Keywords :
MOSFET; capacitance; electron mobility; ion implantation; oxidation; semiconductor device measurement; tunnelling; 3.7 nm; MOSFET; N implant; Si:N-SiO/sub 2/; capacitance-voltage measurements; channel doping concentration; drive currents; gate oxide growth; large area transistors; low field inversion mobility; nMOS transistors; quantization effects; reduced electron mobility; simulation fit; submicron transistors; thickness determination; thin gate-oxides; tunneling effects; Area measurement; Capacitance measurement; Capacitance-voltage characteristics; Current measurement; Degradation; Electron mobility; Implants; MOSFETs; Nitrogen; Thickness measurement;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.841304
Filename :
841304
Link To Document :
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