Planarised interconnection technology using a new pillar formation method with multistacked metal structure

A multilevel interconnection technology using both a new pillar structure consisting of multi-stacked metal layers and chemical-mechanical polishing planarisation has been proposed. This has several advantages such as self-aligned interconnection and decreased via-pillar resistance. The via-pillar resistance becomes one third of conventional via. In addition this method can improve the planarisation capability of inter-metal dielectrics