• DocumentCode
    1333111
  • Title

    A 0.25 \\mu m InP DHBT 200 GHz+ Static Frequency Divider

  • Author

    Amore, Matt D. ; Monier, Cedric ; Lin, Steven Taiyu ; Oyama, Bert ; Scott, Dennis W. ; Kaneshiro, Eric N. ; Chang, Ping-Chih ; Sato, Kenneth F. ; Niemi, Alex ; Dang, Linh ; Cavus, Abdullah ; Gutierrez-Aitken, Augusto ; Oki, Aaron K.

  • Author_Institution
    Northrop Grumman Aerosp. Syst., Redondo Beach, CA, USA
  • Volume
    45
  • Issue
    10
  • fYear
    2010
  • Firstpage
    1992
  • Lastpage
    2002
  • Abstract
    Static frequency dividers are widely used technology performance benchmark circuits. Using a 0.25 μm 530 GHz fT /600 GHz+ fmax InP DHBT process, a static frequency divider circuit has been designed, fabricated, and measured to operate up to 200.6 GHz. The divide-by-two core flip-flop dissipates 228 mW. Techniques used for the divider design optimization and for selecting variants to maximize performance across process changes are also discussed.
  • Keywords
    III-V semiconductors; frequency dividers; heterojunction bipolar transistors; indium compounds; millimetre wave bipolar transistors; DHBT process; InP; divide-by-two core flip-flop; divider design optimization; frequency 530 GHz; power 228 mW; size 0.25 mum; static frequency divider circuit; DH-HEMTs; Frequency conversion; Indium phosphide; Inductance; Load modeling; Performance evaluation; Resistance; Digital; HBT; InP; divider; frequency; high speed; static;
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/JSSC.2010.2058171
  • Filename
    5584965