• DocumentCode
    1333527
  • Title

    Quasi-TEM characteristic impedance of micromachined CMOS coplanar waveguides

  • Author

    Ozgur, Mehmet ; Milanov, V. ; Zincke, Christian ; Gaitan, Michael ; Zaghloul, Mona E.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., George Washington Univ., Washington, DC, USA
  • Volume
    48
  • Issue
    5
  • fYear
    2000
  • fDate
    5/1/2000 12:00:00 AM
  • Firstpage
    852
  • Lastpage
    854
  • Abstract
    Micromachined coplanar waveguides (CPW´s) fabricated in CMOS technology consist of glass-encapsulated metal conductor strips, fully suspended by selective etching of the silicon substrate. The minimum amount of etching necessary for proper operation of the micromachined waveguides is determined by using an isolation criterion. In this paper, the quasi-TEM characteristic impedance of a CPW is derived, including the finite conductor thickness and the thicknesses of surrounding dielectric layers. The employed analytical approach is based on conformal mapping and the partial capacitance technique. The losses both in conductor and dielectric layers are neglected. The analytical results and proposed approximations are verified by integral-equation computation and by measurement of various sample structures
  • Keywords
    CMOS integrated circuits; capacitance; coplanar waveguides; electric impedance; etching; integral equations; micromachining; silicon; waveguide theory; Al-SiO2-Si; CMOS coplanar waveguides; Si; Si substrate; conformal mapping; dielectric layer thickness; finite conductor thickness; glass-encapsulated metal conductor strips; integral-equation computation; isolation criterion; micromachined CMOS CPW; partial capacitance technique; quasi-TEM characteristic impedance; selective etching; CMOS technology; Conductors; Coplanar waveguides; Dielectric losses; Dielectric substrates; Etching; Impedance; Isolation technology; Silicon; Strips;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.841883
  • Filename
    841883